Radiative Substrate Heaters

  • Radiative heater and controller

  • Radiative heater inside PLD system

  • Manual substrate loading

  • Manual substrate loading

  • Example substrate carriers

  • Substrate loading with load lock arm: Engage

  • Substrate loading with load lock arm: Lift

  • Substrate loading with load lock arm: Retract

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Neocera radiative substrate heaters provide a maximum substrate temperature of 850°C. The heaters are UHV compatible and also Oxygen compatible up to a maximum of 1 atmosphere of Oxygen. The radiative heating element is a resistive coil with a maximum working temperature of 1050˚C, facilitating a maximum substrate temperature of 850˚C. The primary heating of the substrates is through radiation from the heating coil. K-type thermocouple laser-welded to the heating coil provides input to the PID temperature controller. The actual substrate temperature is measured by a calibrated external pyrometer. The radiative heaters are available in various substrate sizes (2-inch, 4-inch, 6-inch and 8-inch), 2-inch being the most common. When smaller substrate sizes are used, various types of substrate carriers/inserts can be provided as shown below. The wafer carriers used in radiative heaters are load-lock compatible.

Substrate temperature
850 °C (max)
Substrate size
2" diameter standard. 5 mm x 5 mm or 10 mm x 10 mm substrates need inserts. 4", 6" and 8" diameter heaters also available.
Oxygen Compatibility
Up to 1 atm (760 Torr) of Oxygen
Substrate rotation
360° continuous, 30 RPM maximum
Temperature control
K-type thermocouple, PID control loop. Phase angle controlled. Power supply included.
Temperature stability
Temperature uniformity
Subrtrate position adjustability
Can be Z-adjusted with optional Z stage.
Other features
  • Pre-ablation shutter included.
  • High-pressure RHEED compatible
  • Can be integrated with Neocera system software (Labview 2013)