Pioneer 180 PLD System
Special Features
- Stand-alone turn-key PLD System.
- Deposition of epitaxial films, multilayer heterostructures and Superlattices.
- Deposition of nanoscale thin films using insitu RHEED diagnostics.
- Oxygen compatibility for oxide film depositions.
- Upgrades: Ion-assisted PLD, Combinatorial PLD, Target-Substrate load-locks.
- Additional deposition sources: Pulsed Electron Deposition (PED), RF/DC Sputtering, DC ion guns.
- Integration with XPS /ARPES UHV Cluster tools, insitu UHV wafer transfer.
- Insitu diagnostics: Low Angle X-ray Spectroscopy (LAXS) and Ion Energy Spectroscopy (IES).
Overview
Pioneer 180 PLD System is a turn-key PLD system for preparing high quality epitaxial films, multi-layer heterostructures and superlattices of a variety of materials on a variety of substrates. The primary difference between this PLD system and the Pioneer 120 Advanced PLD System is that the PLD System features a larger deposition module facilitating a number of upgrades that may be limited in Pioneer 120 Advanced PLD System. Pioneer 180 integrates an Oxygen compatible radiative heating stage. The heater is Oxygen compatible up to 1 atmosphere (760 Torr) of Oxygen, a unique feature valuable for preparing epitaxial oxide films that require (i) deposition in Oxygen, (ii) post deposition annealing in Oxygen and also cool-down in Oxygen pressures approaching 1 atmosphere. The substrates rotate continuously and can be load-locked.
Pioneer 180 PLD System includes an automated multi-target carousel with target rotation, target raster and software controlled target selection as needed for multilayer and superlattice depositions. A closed loop pressure control provides precise process pressure control using mass flow controllers. The dry pumping package is a combined turbomolecular pump backed by a mechanical diaphragm or scroll pump. The System software (Windows 7, LabView 2013) controls the substrate heater, target carousel, process pressure, System pumps and laser triggering. Since the substrate can be transferred, a variety of options become feasible. These include but not limited to integrating the PLD system with a variety of other deposition platforms such as UHV Sputter Systems and also with UHV analytical systems such as XPS/ARPES etc.